Thank you, Werner and Dave.
Exactly.
I am totally familiar with Dave's papers on this subject. I felt it is
one of the best papers on the subject, in fact, I hold myself guilty for
having sent Dave's papers on this subject to many people within the
industry. I have other, similar papers from overseas where they had the
same results as Dave's. Same with your magazine articles on the subject
as well, Werner.

And although the papers dealt with primarily the effects on reliability
of mixing LF BGA solder balls with leaded solder, I am simply extending
that to all components being soldered to a LFHSL board using standard
63/37 solder.
 

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
/*
Sent: Monday, January 14, 2008 8:59 AM
To: [log in to unmask]
Subject: Re: [LF] Lead-free HASL finishes

Hi Dean,
Dave Hillman, and others, did quite a bit of work on this. The gist is
if you mix LF and PbSn, the SJs are more or less o.k. if soldered at LF
temperatures, but you are courting trouble at SnPb reflow temperatures.



Werner



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