Keith,

It's understandable that from your POV, you are approaching whisker risks at a 
a board level.  Some of those stresses can be induced at assembly, so there 
is still some indeterminate level of risk involved.  In Richard's case, however, 
assembly processes reduce the risk as lead is added to the finished joint.

When we were planning for lead free, I had quite a battle with management to 
spend a few more pennies to go with the "safer" (in our applications) ENiG 
finishes, with the promise that the industry would respond to pressure to 
improve lead free HASL, and whiskerphobia would soon prove itself out one 
way or another.  So I'm very happy to read your last two posts, knowing that 
they will come back to me soon looking for the cost savings.  

I'm assuming the SnCuNiGe process is cheaper than ENiG or ImAg, right?

Pete

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