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Date: | Mon, 28 Jan 2008 13:15:57 -0500 |
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Gaby
I installed the first immersion silver process in North America and
qualified it at the AT&T assembly locations. I would suggest you do all of
the above. Concerning Micro voids, read McDermid's (Don Cullen's) paper on
this issue. It presents a great deal of imperial evidence on micro vias. You
should also consider the fab supplier in this equation. A poorly implemented
out of control process can render a poor product even though the chemistry
may be sound and with a great pedigree.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: "Gabriela Bogdan" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, January 28, 2008 12:30 PM
Subject: [TN] Microvoids immersion silver
> Dear Netters,
> Is there a preferred process for immersion silver finish in order to
> minimize microvoids?
> How do you choose the preferred immersion silver PCB supplier?
> Which test for bare boards could give the best information?
> Should I perform a print and reflow test for each batch, followed by
> x-ray?
> Which tests are the suppliers performing?
> Thanks,
> Gaby
>
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