Dave and Werner,
Are both of you saying that the interaction between Sn (solder) and Cu(Ni)/Sn intermetallics is similar to interaction between Sn and Au/Sn ones?
As far as I know, Cu (or Ni) containing ones don't have as weak interface with Sn as the Au-containing one.
Regards,
Vladimir
----- Original Message -----
From: TechNet <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Sent: Thu Jan 17 14:45:09 2008
Subject: Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic
Thanks Dave,
Who said that an 'old dog' can't learn any new tricks? How did they keep the
Cu3Sn and Cu6Sn5from oxidyzing? N2 enclosure?
Werner
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