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Date: | Mon, 14 Jan 2008 10:27:25 -0600 |
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IPC International Conference on Flexible Circuits
Phoenix, Ariz.
February 13, 2008 - Conference
February 12 & 14, 2008 - Educational Courses
Fine-lined? Multi-layered? Highly dense with IC packages on top? Flex
offers an array of choices with a growing number of benefits. Learn
about manufacturing technologies, high density flex and new applications
at the IPC International Conference on Flexible Circuits being held
February 12-14, 2008, in Phoenix, Ariz. Educational courses will be
offered on February 12 and 14. The technical conference will be held
February 13, 2008.
For more information or to register, please cut and paste
www.ipc.org/flex into your browser and download the registration form.
For additional questions, please contact Alexandra Curtis at +1
847-597-2877 or at [log in to unmask]
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