Rich,
Must be a bad day (more snow is coming to our Hoosier homes tonight) because
I am working late.
Anyway, I remember a poster paper Bev Christian gave at an Expo (2005 or
2006?) on this very subject of component cleanliness. So I have copied Bev in,
or maybe some of the other regulars on TechNet remember the poster (I think
that would have put the document in the IPC technical proceedings, but I don't
have that at hand here right now.). Maybe it was 2005, as that was the Expo
year we had all the foreign papers as part of the World Electronics Circuits
Council event, and some other good papers got pushed out.
Of course, I don't remember full details, but seems to me Bev and RIM found
a lot of variablity in component cleanliness, right after they had beaten up
the board fabricators to ship clean boards. Sorry, I can't remember if they
quoted a standard, or were making up one for their own incoming
inspection/qualification.
Bev or others, help out.
Denny Fritz
MacDermid, Inc.
In a message dated 12/5/2007 9:31:57 P.M. Eastern Standard Time,
[log in to unmask] writes:
I know that documents and standards exist for assemblies & PCB's, but
are any of you aware of any IPC (or other industry) documents that deal
with the cleanliness (both residual and/or particulate) of components or
mechanical parts such as housings, heat sinks, etc?
Rumor has it that there are some purchasing trade groups that may also
address this topic.
Rich K
Kimball - GTS
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