TECHNET Archives

December 2007

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Need clarification on Table 3-2
From:
Franklin Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Franklin Asbell <[log in to unmask]>
Date:
Thu, 6 Dec 2007 15:13:42 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (41 lines) 
I’m looking at Table 3-2 of IPC 6012BA1. Under Code C, Through Holes, Class
3, Minimum Wrap.

 

I interpret this to mean the copper extending from the hole wall wrapping
onto the surface (forming the annual ring) shall be a minimum of ½ mil (472
uin) for a distance of 1 mil (984 uin) from the hole edge.

 

This ½ mil is not including the foil or additional plating (i.e. capping the
via).

 

Am I reading this correctly?

 

Thanks,

 

Franklin D Asbell

 

 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2