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December 2007

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Date:
Wed, 5 Dec 2007 15:38:40 +0000
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GA Tan

To my knowledge this coating was developed for space programmes  
because it features low or no out-gassing.

The material is quite tricky to handle and apply correctly and, again  
if my memory is not deserting me, it is 2 component. This means that  
it is really undesirable for dipping because you will throw away far  
more than you will use.

If you send me a copy of the data sheet, I can probably give more  
advice.

Kindest regards
Graham Naisbitt

[log in to unmask]

www.gen3systems.com

Phone: +44 (0)12 5252 1500
Mobile: +44 (0) 79 6858 2121


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Gen3 Systems Limited Unit B2, Armstrong Mall Southwood Business Park Farnborough Hampshire GU14 0NR - UK ENGINEERING RELIABILITY IN ELECTRONICS Registered Number: 4639449 (England & Wales). Registered Office as above. DISCLAIMER : This message is intended only for the use of the individual or entity to which it is addressed and may contain information which is privileged, confidential, proprietary, or exempt from disclosure under applicable law. If you are not the intended recipient or the person responsible for delivering the message to the intended recipient, you are strictly prohibited from disclosing, distributing, copying, or in any way using this message. If you have received this communication in error, please notify the sender and destroy and delete any copies you may have received. Any views or opinions presented in this email are solely those of the author and might not represent those of Gen3 Systems Limited. Although Gen3 Systems Limited has taken reasonable precautions to ensure no viruses present in this email, Gen3 Systems Limited can not accept the responsibility for any loss or damage arising from the use of this email or attachments. On 5 Dec 2007, at 09:10, Tan Geok Ang wrote: > Hi All, > > I need help and guidance on dipping conformal coating > of Solithane. > > Can anyone provide me with some guidance on "Dipping > and Rework" processes and requirement (not spray). > > a) What is the right viscosity of the mixture > between Solithane 113 and C113-300? To ensure right coating and to > eliminate bubbles effects? > > b) What temperature to set to ensure the process > (thickness) consistence during the dipping process > > c) Must there be another air spray (temperature > control?) process to ensure the coating thickness. > > d) What is the speed on dipping and removing? > > > > e) What will be pot life of the mixture? > > f) What is the recommended curing method > (temperature curve? or must be 5days or 10days requirement) > > g) If there are connectors, other then using RTV to > cover these connector. Is there any other better and consistent > matter to ensure that coating mixture does not move into the > connectors? > > h) What chemicals is/are available to remove/rework > on the coating if a component needs to be replaced? What other > things must be taken note of? > > i) If the PCBA is cleared, should I bake those PCBA > before the process (or same temperature as the coating mixture just > before use?) > > > > Sorry that I have some many questions as I am task to work and > develop on this process and implement it within a month so your > help and guidance is greatly appreciated! Thanks > > > > Best Regards > > GA Tan > > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail > to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/ > archives > Please visit IPC web site http://www.ipc.org/contentpage.asp? > Pageid=4.3.16 for additional information, or contact Keach Sasamori > at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------

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