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December 2007

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Subject:
From:
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (EHCOE)
Date:
Tue, 4 Dec 2007 07:19:54 -0700
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Doug's attempts at getting a cleaning contract for SMT reflow ovens were
foiled.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
Sent: Tuesday, December 04, 2007 7:06 AM
To: [log in to unmask]
Subject: Re: [TN] SILVER IMMERSION BOARDS ISSUE

Guy,
I have been involved with the SIR Handbook for quite some time and can't

recall any sections on cleaning SMT reflow ovens.  Humidity chambers,
yes. 
 Reflow ovens, no.

Doug Pauls




Guy Ramsey <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
12/04/2007 07:57 AM
Please respond to
[log in to unmask]


To
[log in to unmask]
cc

Subject
Re: [TN] SILVER IMMERSION BOARDS ISSUE






Yes, I think our problem was oven contamination. We started wrapping
immersion silver boards in aluminum foil (loosely) during the bake. We 
have
not had any problems with delaminating or solder performance using this 
bake
out process. 

We have not tried to clean the oven yet, as we rarely see immersion 
silver.
I understand it is rather difficult. I think there are instructions in
the
IPC SIR Handbook. 

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