TECHNET Archives

December 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
Date:
Tue, 4 Dec 2007 08:57:30 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (53 lines)
Yes, I think our problem was oven contamination. We started wrapping
immersion silver boards in aluminum foil (loosely) during the bake. We have
not had any problems with delaminating or solder performance using this bake
out process. 

We have not tried to clean the oven yet, as we rarely see immersion silver.
I understand it is rather difficult. I think there are instructions in the
IPC SIR Handbook. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roberts, Jon
Sent: Monday, December 03, 2007 5:30 PM
To: [log in to unmask]
Subject: [TN] SILVER IMMERSION BOARDS ISSUE

We are experiencing silver immersion boards tarnishing during the solder
process (SMT Reflow).  Board manufacture along with some of our SMT process
engineer believe is sulfur getting on the board/assembly.  Has anyone
experience this recently?  Suspect areas are plastic bags, rubber bands, and
oven contamination. Any ideas or thoughts will be appreciated, Jon 

This communication is intended only for use by the addressee(s) named herein
and may contain business confidential and/or legally privileged information.
If you are not the intended recipient of this e-mail, you are hereby
notified that any dissemination, distribution, disclosure or copying of this
e-mail and its contents is strictly prohibited. If you have received this
e-mail in error, kindly notify the sender by replying to this message. In
addition, please permanently delete the message and any attachments without
copying or disclosing the contents. Thank you for your cooperation.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
unsubscribe, send a message to [log in to unmask] with following text in the
BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet
NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send
e-mail to [log in to unmask]: SET Technet Digest Search the archives of
previous posts at: http://listserv.ipc.org/archives Please visit IPC web
site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2