Flash Gordon is good too.../Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För Yuan-chia Joyce Koo
Skickat: den 30 december 2007 22:36
Till: [log in to unmask]
Ämne: Re: [TN] SV: [TN] SV: [TN] Hand Soldering Matte Tin over Nickel Flash
with SnPb Alloy
immAu is not flash to me. flash is electroplated gold. Much better
adhesion compare to the immAu.
jk
On Dec 30, 2007, at 12:44 PM, David Hoover wrote:
> And what some call a "gold flash" in Europe might be something
> different than what someone
> calls a "gold flash" in the US. (One could be ImmAu and one could
> be Electroplated Gold)
> Regardless..as pointed out in the email string there is a few ways
> to measure the deposited
> Nickel thickness.
>
> Happy Holidays,
>
> Groovy
> ----- Original Message ----- From: "Hfjord" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Sunday, December 30, 2007 7:26 AM
> Subject: [TN] SV: [TN] SV: [TN] Hand Soldering Matte Tin over
> Nickel Flash with SnPb Alloy
>
>
> Correct, flash can't be measured with SEM. My point is a fast and
> simple
> check to see if the layers are thinner than 2-3 micrometers. If you
> don't
> see any tin or nickel with a SEM, then, it is flash, and flash as
> finish for
> a SMT component is foreign for me....and probably most of us. Only
> flash I'm
> used to see is gold flash.
> Inge
>
> -----Ursprungligt meddelande-----
> Från: TechNet [mailto:[log in to unmask]] För Yuan-chia Joyce Koo
> Skickat: den 30 december 2007 15:03
> Till: [log in to unmask]
> Ämne: Re: [TN] SV: [TN] Hand Soldering Matte Tin over Nickel Flash
> with SnPb
> Alloy
>
> Can't you use micro-XRF? flash is hard to x-section and detect even
> using SEM (unless very good at polishing without smear)... jk
> On Dec 29, 2007, at 6:15 PM, Hfjord wrote:
>
>> Nickel flash! You'd better tell us the whole story, e.g. post the
>> datasheet
>> to Steve or give a link. Agree with George, make Xsection, takes
>> half an
>> hour with fast acrylic, 600+2500 paper polish, dip a few seconds in
>> an acid
>> solution, just for making a topographic contrast, put the sample in
>> a SEM
>> with backscatter detector and see if the layers are thinner than
>> let's say
>> 2-3 micrometers (you can't do any precision measurements this way).
>> If both
>> tin and nickel is thinner than that, I'd recommend pulling the
>> emergency
>> brake and do what George recommended.
>>
>> So....Christmas is over for many...I'm lucky to have a few days
>> more as
>> free...ZZZZZZZZZZZZ
>>
>> Inge
>>
>> PS. Forgot to tell you, if you are not used to sample preparation:
>> use a
>> whole bunch of resistors, not just one! There may be variations
>> too....
>>
>> -----Ursprungligt meddelande-----
>> Från: TechNet [mailto:[log in to unmask]] För Wenger, George M.
>> Skickat: den 28 december 2007 19:05
>> Till: [log in to unmask]
>> Ämne: Re: [TN] Hand Soldering Matte Tin over Nickel Flash with SnPb
>> Alloy
>>
>> I think the first thing I would do is to determine what p
>> Chris,
>>
>> I think the first thing I would do is to determine what part of the
>> component surface I was soldering to by running a trial and by doing
>> cross sections. The trial would be to solder side by side a
>> component
>> that had formed leads and one that didn't have formed leads. I would
>> also cross section two other components (one with formed leads and
>> one
>> without)before soldering to see if the soldering problem is due to
>> the
>> fact that the forming process exposes nickel in the area that is
>> being
>> soldered. I'd also do a third evaluation and us an XRF to measure
>> the
>> thickness of the Sn and the Ni on the component leads both before and
>> after forming. It might just turn out that you're having
>> solderability
>> issues because you're soldering to exposed Ni rather than matte Sn.
>>
>> Regards,
>> George
>> George M. Wenger
>> Andrew Corporation Wireless Network Solutions
>> Senior Principal FMA / Reliability Engineer
>> 40 Technology Drive, Warren, NJ 07059
>> (908) 546-4531 [Office] (732) 309-8964 [Cell]
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Schaefer
>> Sent: Friday, December 28, 2007 12:00 PM
>> To: [log in to unmask]
>> Subject: [TN] Hand Soldering Matte Tin over Nickel Flash with SnPb
>> Alloy
>>
>> Greetings All,
>>
>> I have a PTH TK type resistor component that is formed to fit an SMT
>> geometry land pattern. The component is Pb Free component plated
>> using
>> Matte Tin over Nickel Flash. Once the component is soldered it
>> exhibits
>> non-
>> wetting/ poor wetting characteristics thus causing us to rework
>> until we
>> have
>> achieved acceptable results. Of course this is not what I would
>> like to
>> see
>> occur, but unfortunately at this time it is the process. The
>> installation process
>> is as follows:
>>
>> - Part is formed using a lead forming tool
>> - Is tinned using 25% RMA for 3 seconds and let to dry (somewhat);
>> then
>> soldered (SnPb tin/ lead alloy) for 3-4 seconds in a 600F bath
>> - It is soldered (SnPb tin/ lead alloy) to the cca using a 6ooF
>> solder
>> iron tip for
>> 2-3 seconds
>> - END...
>>
>> Apparently this has been an issue for years, but just recently was
>> brought up
>> to our Engineering department. We tin the component to allow for
>> improved
>> wetting characteristics, but this does not provide much
>> improvement. I
>> have
>> done some investigation on the internet looking for reports and tests
>> performed soldering Matte Tin over Nickel using standard Tin/ Lead
>> alloy, but
>> have found very little information regarding this. The component
>> manufacture
>> states our process as described to them 'should work without issue,
>> but
>> this is
>> not the case.
>>
>> So my questions are what are the issues related to soldering matte
>> tin
>> over
>> nickel flash with tin/ lead alloy? What hand soldering parameters are
>> considered optimal/ ideal with a low-mass matte tin plated component
>> considering the information provided? Is it possible to get very
>> similar
>> results
>> using this combination of metallurgies versus using tin/ lead plating
>> and solder
>> materials?
>>
>> Any help would be appreciated.
>>
>> Thank You,
>>
>> Chris
>>
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