immAu is not flash to me. flash is electroplated gold. Much better
adhesion compare to the immAu.
jk
On Dec 30, 2007, at 12:44 PM, David Hoover wrote:
> And what some call a "gold flash" in Europe might be something
> different than what someone
> calls a "gold flash" in the US. (One could be ImmAu and one could
> be Electroplated Gold)
> Regardless..as pointed out in the email string there is a few ways
> to measure the deposited
> Nickel thickness.
>
> Happy Holidays,
>
> Groovy
> ----- Original Message ----- From: "Hfjord" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Sunday, December 30, 2007 7:26 AM
> Subject: [TN] SV: [TN] SV: [TN] Hand Soldering Matte Tin over
> Nickel Flash with SnPb Alloy
>
>
> Correct, flash can't be measured with SEM. My point is a fast and
> simple
> check to see if the layers are thinner than 2-3 micrometers. If you
> don't
> see any tin or nickel with a SEM, then, it is flash, and flash as
> finish for
> a SMT component is foreign for me....and probably most of us. Only
> flash I'm
> used to see is gold flash.
> Inge
>
> -----Ursprungligt meddelande-----
> Från: TechNet [mailto:[log in to unmask]] För Yuan-chia Joyce Koo
> Skickat: den 30 december 2007 15:03
> Till: [log in to unmask]
> Ämne: Re: [TN] SV: [TN] Hand Soldering Matte Tin over Nickel Flash
> with SnPb
> Alloy
>
> Can't you use micro-XRF? flash is hard to x-section and detect even
> using SEM (unless very good at polishing without smear)... jk
> On Dec 29, 2007, at 6:15 PM, Hfjord wrote:
>
>> Nickel flash! You'd better tell us the whole story, e.g. post the
>> datasheet
>> to Steve or give a link. Agree with George, make Xsection, takes
>> half an
>> hour with fast acrylic, 600+2500 paper polish, dip a few seconds in
>> an acid
>> solution, just for making a topographic contrast, put the sample in
>> a SEM
>> with backscatter detector and see if the layers are thinner than
>> let's say
>> 2-3 micrometers (you can't do any precision measurements this way).
>> If both
>> tin and nickel is thinner than that, I'd recommend pulling the
>> emergency
>> brake and do what George recommended.
>>
>> So....Christmas is over for many...I'm lucky to have a few days
>> more as
>> free...ZZZZZZZZZZZZ
>>
>> Inge
>>
>> PS. Forgot to tell you, if you are not used to sample preparation:
>> use a
>> whole bunch of resistors, not just one! There may be variations
>> too....
>>
>> -----Ursprungligt meddelande-----
>> Från: TechNet [mailto:[log in to unmask]] För Wenger, George M.
>> Skickat: den 28 december 2007 19:05
>> Till: [log in to unmask]
>> Ämne: Re: [TN] Hand Soldering Matte Tin over Nickel Flash with SnPb
>> Alloy
>>
>> I think the first thing I would do is to determine what p
>> Chris,
>>
>> I think the first thing I would do is to determine what part of the
>> component surface I was soldering to by running a trial and by doing
>> cross sections. The trial would be to solder side by side a
>> component
>> that had formed leads and one that didn't have formed leads. I would
>> also cross section two other components (one with formed leads and
>> one
>> without)before soldering to see if the soldering problem is due to
>> the
>> fact that the forming process exposes nickel in the area that is
>> being
>> soldered. I'd also do a third evaluation and us an XRF to measure
>> the
>> thickness of the Sn and the Ni on the component leads both before and
>> after forming. It might just turn out that you're having
>> solderability
>> issues because you're soldering to exposed Ni rather than matte Sn.
>>
>> Regards,
>> George
>> George M. Wenger
>> Andrew Corporation Wireless Network Solutions
>> Senior Principal FMA / Reliability Engineer
>> 40 Technology Drive, Warren, NJ 07059
>> (908) 546-4531 [Office] (732) 309-8964 [Cell]
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Schaefer
>> Sent: Friday, December 28, 2007 12:00 PM
>> To: [log in to unmask]
>> Subject: [TN] Hand Soldering Matte Tin over Nickel Flash with SnPb
>> Alloy
>>
>> Greetings All,
>>
>> I have a PTH TK type resistor component that is formed to fit an SMT
>> geometry land pattern. The component is Pb Free component plated
>> using
>> Matte Tin over Nickel Flash. Once the component is soldered it
>> exhibits
>> non-
>> wetting/ poor wetting characteristics thus causing us to rework
>> until we
>> have
>> achieved acceptable results. Of course this is not what I would
>> like to
>> see
>> occur, but unfortunately at this time it is the process. The
>> installation process
>> is as follows:
>>
>> - Part is formed using a lead forming tool
>> - Is tinned using 25% RMA for 3 seconds and let to dry (somewhat);
>> then
>> soldered (SnPb tin/ lead alloy) for 3-4 seconds in a 600F bath
>> - It is soldered (SnPb tin/ lead alloy) to the cca using a 6ooF
>> solder
>> iron tip for
>> 2-3 seconds
>> - END...
>>
>> Apparently this has been an issue for years, but just recently was
>> brought up
>> to our Engineering department. We tin the component to allow for
>> improved
>> wetting characteristics, but this does not provide much
>> improvement. I
>> have
>> done some investigation on the internet looking for reports and tests
>> performed soldering Matte Tin over Nickel using standard Tin/ Lead
>> alloy, but
>> have found very little information regarding this. The component
>> manufacture
>> states our process as described to them 'should work without issue,
>> but
>> this is
>> not the case.
>>
>> So my questions are what are the issues related to soldering matte
>> tin
>> over
>> nickel flash with tin/ lead alloy? What hand soldering parameters are
>> considered optimal/ ideal with a low-mass matte tin plated component
>> considering the information provided? Is it possible to get very
>> similar
>> results
>> using this combination of metallurgies versus using tin/ lead plating
>> and solder
>> materials?
>>
>> Any help would be appreciated.
>>
>> Thank You,
>>
>> Chris
>>
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