Join IPC at one their upcoming events in Phoenix, Ariz.!
IPC International Conference on Flexible Circuits
February 12-14, 2008
Phoenix, Ariz.
Join IPC to get the most up-to-date and cutting edge information on
flexible circuitry! Learn about manufacturing technologies, high density
flex and new applications at the IPC International Conference on
Flexible Circuits being held February 12-14, 2008, in Phoenix, Ariz.
Educational courses will be offered on February 12 and 14. The technical
conference will be held February 13, 2008.
Workshops being offered on February 12 and February 14 include:
Flex Circuit Fundamentals
February 12, 2008
1:00 pm - 4:00 pm
Instructor: Ken Gilleo, Ph.D., ET-Trends LLC
Materials uniqueness is an important reason for the excellent
cost/performance value of flex and this will be covered in detail. Flex
is halogen free and easily handles high temperature lead-free solders.
All flex materials, including Liquid Crystal Polymer (LCP), will be
described and compared. Both standard and newer processes are covered,
including laser machining and fluid jetting (inkjet). Also discussed
will be RFID products and the emerging area of "flexible electronics"
(organic/plastic electronics).
Flex Circuitry Applications - from Inner to Outer Space and in Between
February 12, 2008
8:30 am - 11:30 am
Instructor: Ken Gilleo, Ph.D., ET-Trends LLC
We will discuss the flex attributes of high density, remarkable
durability, designed flexibility, extreme thinness, and exceptional
thermal resistance. Flex-based packages offer efficient miniaturization,
lightness and durability while providing 3D configurability for stacked
multi-chip modules. Flex packages include CSPs, WLCSPs, Chip-on-Flex,
TAB, Tape Carrier Packages, microBGAs, TapeBGAs, FlexBGAs and folded
arrays. Find out why flex, the original chip carrier, has the highest
performance.
Fundamentals of Printed Circuits - Materials, Structures and Processes
February 12, 2008 - Phoenix, Ariz.
8:30 am - 5:00 pm
Instructor: Joseph Fjelstad, Verdant Electronics
PCBs are the electrical interconnection platform for nearly every
electronic product. This tutorial provides a detailed overview of this
indispensable technology. It reviews the materials and processes that
comprise the wide array of electronic interconnection substrates used
today - and explains why they were chosen. Join us for this tutorial,
and benefit from a solid overview of key fundamentals.
Desmear Metallization and Plating of Flex & Rigid Flex Printed Wiring
Boards
February 14, 2008 - Phoenix, Ariz.
8:30 am - 11:30 am
Instructor: Michael Carano, Electrochemicals, Inc.
Understanding the intricate nature of materials and processes is
critical to ensuring highly reliable performance of printed wiring
boards. In this workshop, you will gain insights and get recommendations
on the desmear and metallization of flexible, rigid-flex and
high-performance rigid materials. Be sure to join us for this
enlightening workshop!
Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect
Analysis and Prevention
February 14, 2008 - Phoenix, Ariz.
1:00 pm - 4:00 pm
Instructor: Michael Carano, Electrochemicals, Inc.
What are the critical success factors for a defect-free PWB fabrication
process and maximum long-term reliability? This course tackles the
answers! Join us for this half-day workshop and gain the
process-technology know-how you need to improve the yield, quality and
reliability of complex printed wiring boards.
HOTEL INFORMATION
The educational courses and technical conference will take place at the
Grace Inn Phoenix, 10831 S. 51st Street, Phoenix, Ariz. To reserve your
room, contact the hotel directly at +1 800-843-6010 and ask for the IPC
conference rate of $99 (single/double) per night. Rate is subject to
change after January 7, 2008.
Early Registration - Register by January 14, 2008 and save an additional
10% off the prices shown below or register three individuals from your
company at the same time and receive the fourth registration FREE. For
more information or to register, please cut and paste www.ipc.org/Flex
into your browser and download the registration form. For additional
questions, please contact Alexandra Curtis at +1 847-597- 2877 or at
[log in to unmask]
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