Hi Tom,
Maybe the pin location are not that random. With the exception of P16, they 
may all be at the outline of the die—I do not know your die size, but I am 
guessing. You did not give a thermal history; is it possible that you have 
creep-fatigue failures?
214.5 certainly should be sufficient for proper wetting of eutectic SnPb, if 
you have solderability.
In order to find out, you need to sacrifice some of your product to 
cross-sectioning.



Werner



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