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December 2007

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Subject:
From:
Joel Alexander <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 3 Dec 2007 10:01:01 -0500
Content-Type:
text/plain
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text/plain (98 lines)
I do not know the humidity level but from what I can tell from the return 
water is condensing to the extent that drops are rolling off the backplane 
in some locations



Joel Alexander
Quality Assurance Manager
TT APSCO, INC. 




"Whittaker, Dewey (EHCOE)" <[log in to unmask]> 
12/03/2007 09:46 AM


To
"TechNet E-Mail Forum" <[log in to unmask]>, <[log in to unmask]>
cc

Subject
RE: [TN] Wave solder flux volume measurements






Your Environmental condition was damp/moist. Is that opposed to damp/dry
or dry/moist? It would more helpful to relate it to temperature and
relative humidity with the additional qualifier of standing water or
not.
A general rule of thumb (besides move it before striking with heavy
objects) is that no-cleans should not be used in that application. A
cleanable no-clean or better yet a water soluble flux should be used.
Dewey 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Alexander
Sent: Friday, November 30, 2007 2:25 PM
To: [log in to unmask]
Subject: [TN] Wave solder flux volume measurements

Hi guys its me again,


We have a customer that builds power systems for the Telcom companies. 
They recently had a field failure on a backplane. It had sever
corrosion. 
We process the assembly  with a VOC no-clean solder and have never had 
issues in the past. The customer indicated that the backplane was in a 
damp/moist environment. That is not a good combination for no clean
flux. 
I suggested cleaning but they insisted that we monitor our flux volume
to 
ensure it is at the recommended application volume. I did not really
agree 
from a reliability standard. 

Does anyone out there measure their no clean flux volume on a regular 
basis?



Joel Alexander
Quality Assurance Manager
TT APSCO, INC. 

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