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December 2007

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Subject:
From:
Tony Steinke <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tony Steinke <[log in to unmask]>
Date:
Wed, 12 Dec 2007 16:31:16 -0500
Content-Type:
text/plain
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text/plain (73 lines)
You may want to specify a minimum of 150 microinches of electroless nickel
compared to the standard of 100. It is just a matter of extending the dwell
time in the nickel by about 10-15 minutes. The cost is minimal unless you
are talking about extremely large volumes.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dwight Mattix
Sent: Wednesday, December 12, 2007 3:02 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Finger plating question.

Yep. ENIG has worked fine for us in some lower cycle insertion apps.  YMMV 
depending on specifics of your app and the connector style used.


At 11:07 AM 12/12/2007, you wrote:
>I have a small panelized SMT SIM module with gold fingers that I was
>going to use ENIG for the entire board including the gold fingers.  I
>was not going to use the standard gold tip process.  This board only
>requires one or two insertions.  Once it is installed most likely it
>will never be removed from the socket.  I've done this on a similar
>board with no issues but wanted some feedback from my fellow
>Techneter's.
>
>
>
>Thanks in advance,
>
>
>
>Scott
>
>
>
>
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