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December 2007

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Subject:
From:
"Victor G. Hernandez" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 12 Dec 2007 07:21:22 -0600
Content-Type:
text/plain
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text/plain (88 lines)
Are there any reliability case studies on this material, technical
papers.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Tuesday, December 11, 2007 12:44 PM
To: [log in to unmask]
Subject: Re: [TN] Polymer sphere BGA Dummy Component Procurement

Dave - if you cannot get them - you could re-ball regular dummy parts -
here
is the link to the polymer ball site:

http://www.sekisui-fc.com/eng/html/jissou/product/jipr_02.html


 
 
John Burke
 
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Tuesday, December 11, 2007 9:02 AM
To: [log in to unmask]
Subject: [TN] Polymer sphere BGA Dummy Component Procurement

Hi gang! Hey, I am looking to procure some dummy, daisy chained  BGA 
components which utilize a copper plated polymer soldersphere instead of
a 
solder alloy soldersphere. These components are typically called 
"polyball" BGAs. I am looking to conduct some solder joint integrity 
testing but have not located a source of the polyball dummy BGA 
components. Does anyone have any suggested/recommended sources? Thanks
in 
advance for your assistance.

Dave Hillman
Rockwell Collins
[log in to unmask]

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