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December 2007

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Subject:
From:
Hernefjord Ingemar <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hernefjord Ingemar <[log in to unmask]>
Date:
Wed, 12 Dec 2007 13:59:15 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (69 lines)
a few questions:

-exactly WHAT get tarnished, dielectric, copper, solder?
-WHAT will be "grounded"? 
-you can't decide RF ground with a multimeter.
-WHAT microwave product do you work with? Sometimes, a board in a
microwave set is not a RF board at all, but driver or logics etc.

Inge
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kong Hui Poh
Sent: den 12 december 2007 13:43
To: [log in to unmask]
Subject: Re: [TN] Tarnished on the bottom side (Teflon Board)


Hi Technetterers,

I am facing with board that after reflow, it turned tarnished.
The board is of tin-lead plating.

The top side of the board consists of the circuitry & components.
The bottom side of the board is a complete plane.

My customers said that there will be grounding due to the tarnished.
However, I try using Multimeter, and probe the bottom side very lightly.
The measurement I got is less than 0.5 Ohm.

Somehow, the measurement shows otherwise.

I wandered if there is an issue with the grounding if the board is
tarnished.

Can someone advise me if any of the IPC spec states that board of
tin/lead plating, if found tarnished is a reject/defect.

Is any of the IPC spec. defines the solder surface requirement for the
Microwave end product (if after reflow).

Thanks you in advance.

Regards,
Poh

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