Hi Technetterers,

I am facing with board that after reflow, it turned tarnished.
The board is of tin-lead plating.

The top side of the board consists of the circuitry & components.
The bottom side of the board is a complete plane.

My customers said that there will be grounding due to the tarnished.
However, I try using Multimeter, and probe the bottom side very lightly.
The measurement I got is less than 0.5 Ohm.

Somehow, the measurement shows otherwise.

I wandered if there is an issue with the grounding if the board is tarnished.

Can someone advise me if any of the IPC spec states that board of  
tin/lead plating, if found tarnished is a reject/defect.

Is any of the IPC spec. defines the solder surface requirement for the  
Microwave end product (if after reflow).

Thanks you in advance.

Regards,
Poh

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