Hi Dave,
Here are some references:
[1] Engelmaier, W., “Achieving Solder Joint Reliability in A Lead-Free
World, Part 2,” Global SMT & Packaging, Vol. 3, No. 8, August 2007, pp. 44-46.
[2] Okinaga, N., et al, (Sekisui) “Excellent Reliability of Solder Ball
Made of a Compliant Plastic Core,” 2001 IEEE Electronic Components and
Technology Conf., 2001, 5 pages.
[3] Klein, M., et al, (Fraunhofer Institute) “A Characterization of
Plastic Core Solder Balls for BGA and flip Chip Applications,” 2002 IMAPS Nordic
Conf., 2002, 6 pages.
[4] Yoon, S., et al, (Hyundai) “CSP Board Level Reliability Testing of
Pb-Free Sn-Ag-X (X=Cu, In) and Polymer-Core Solder Ball,” Proc. 6th Annual Pan
Pacific Microelectronics Symp., Kauai, Hawaii, February 2001, 9 pages.
[5] Movva, S., et al, (Kyocera) “High Reliability Second Level
Interconnects Using Polymer Core BGAs,” 2004 IEEE Electronic Components and Technology
Conf., 2004, pp. 1443-1448.
I will send you a copy of Ref. 1 by separate mail.
To my knowledge, Kyocera is selling them. Here are 2 e-mail addresses:
[log in to unmask], [log in to unmask]
Werner
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