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December 2007

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Subject:
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 11 Dec 2007 15:53:02 EST
Content-Type:
text/plain
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text/plain (42 lines)
Hi Dave,
Here are some references:
[1]     Engelmaier, W., “Achieving Solder Joint Reliability in A Lead-Free 
World, Part 2,” Global SMT & Packaging, Vol. 3, No. 8, August 2007, pp. 44-46.   

[2]     Okinaga, N., et al, (Sekisui) “Excellent Reliability of Solder Ball 
Made of a Compliant Plastic Core,” 2001 IEEE Electronic Components and 
Technology Conf., 2001, 5 pages.   
[3]     Klein, M., et al, (Fraunhofer Institute) “A Characterization of 
Plastic Core Solder Balls for BGA and flip Chip Applications,” 2002 IMAPS Nordic 
Conf., 2002, 6 pages.   
[4]     Yoon, S., et al, (Hyundai) “CSP Board Level Reliability Testing of 
Pb-Free Sn-Ag-X (X=Cu, In) and Polymer-Core Solder Ball,” Proc. 6th Annual Pan 
Pacific Microelectronics Symp., Kauai, Hawaii, February 2001, 9 pages.   
[5]     Movva, S., et al, (Kyocera) “High Reliability Second Level 
Interconnects Using Polymer Core BGAs,” 2004 IEEE Electronic Components and Technology 
Conf., 2004, pp. 1443-1448.   
I will send you a copy of Ref. 1 by separate mail.

To my knowledge, Kyocera is selling them. Here are 2 e-mail addresses: 
[log in to unmask], [log in to unmask]



Werner



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