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December 2007

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From:
Tina Nerad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tina Nerad <[log in to unmask]>
Date:
Tue, 11 Dec 2007 13:34:49 -0600
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Register now for IPC's 2008 upcoming workshops and webcasts! This is
your opportunity to gain insight on the latest information regarding the
latest issues in electronics!  

 

PD-01: Advanced Troubleshooting for Printed Wiring Board Manufacturing -
Defect Analysis and Prevention 
January 15, 2008 - San Jose, CA
8:30 am - 11:30 am

Instructor:  Michael Carano, Electrochemicals, Inc.

 

Please visit this link for additional information:
www.ipc.org/AdvTr0108

 

Join us for this half-day workshop and gain the process-technology
know-how you need to improve the yield, quality and reliability of
complex printed wiring boards. Emphasis is on identifying and preventing
defects with respect to electroless copper and direct metallization,
electroplating, drilling and multilayer fabrication.

 

PD-02: Via Filling Technology and Processes
January 15, 2008 - San Jose, CA
1:00 pm - 4:00 pm

Instructor:  Michael Carano, Electrochemicals, Inc.

 

Please visit this link for additional information:
www.ipc.org/AdvTr0108

Attend this course for insights on the technological drivers behind the
need for highly effective, reliable via filling in high-density,
high-aspect-ratio printed wiring boards. The course pays close attention
to the use of via filling materials for highly complex circuit designs.

PD-03: Fundamentals of Printed Circuit Technology - Materials and
Manufacturing Processes 
January 16, 2008 - San Jose, CA
8:30 am - 11:30 am

Instructor:  Joseph Fjelstad, Silicon Pipe, Inc.

 

Please visit this link for additional information:
www.ipc.org/AdvTr0108

This half-day course provides a comprehensive overview of this
indispensable technology. You will learn about multilayer, metal core,
embossed, flexible and rigid flex circuits and more. Discussions will
also include newer HDI/microvia and embedded passives technologies, new
PCB design concepts and a brief look at the impact of lead free on PCB
manufacturing. 

PD-04: Design Principles for BGA and CSP Technology Implementation
January 16, 2008 - San Jose, CA 
1:00 pm - 4:00 pm

Instructor:  Vern Solberg, Tessera Technologies, Inc.

 

Please visit this link for additional information:
www.ipc.org/AdvTr0108

This workshop is based on the latest version of the IPC-7095 document,
Design and Assembly Process Implementation for BGAs, and covers both
wide and fine-pitch BGA packaging methodology. The information will
focus on IC packaging standards, review qualification requirements and
study land pattern geometry alternatives, circuit routing guidelines as
well as important factors related to high density PCB fabrication
technologies, assembly process development, inspection criteria and
solder quality assessment.

IPC Webcast: Printed Board Fabrication Hot Buttons: Design
Considerations 
January 17, 2008 10:00 am - 11:00 am (CT) 

Instructor:  Dieter Bergman, IPC

Please visit this link for additional information: www.ipc.org/FabWC0108

Let's face it, designers and board manufacturers don't always tell each
other everything! Learn the secrets of the board fabrication process and
where manufacturers are compensating for poor and incomplete designer
instructions. Mastering this missing information can make your boards
more manufacturable and even save you money! Tune in for this
informative Webcast and pick up tips to help you become a more effective
designer today.

IPC Webcast: Routing of High Speed Lines 
January 24, 2008 10:00 am - 11:00 am (CT)

Please visit this link for additional information:
www.ipc.org/HighSpeed0108

Many issues contribute to signal integrity problems in high speed
transmission lines: cross talk, loss tangent of the PCB material, power
bus noise, etc. The single greatest contributor to signal integrity
issues is the lack of proper routing and termination of lines in PC
boards. Understanding a few simple concepts can take a circuit from
failure to success. Understanding the concepts can dramatically reduce
cost and layer count of PC boards.

PCB Laminate Materials and the RoHS Change: IPC-4101 Specification,
Bromine Free and Reliability

March 11, 2008 - IPC Headquarters, Bannockburn, IL

Instructor:  Doug Sober, Kaneka Texas Corporation

Please visit this link for additional information:
www.ipc.org/PBCLam0308

This one-day workshop focuses on laminate and prepreg materials with a
special focus on the grades, properties, testing and composition
necessary lead-free assembly. All grades of base materials used in
printed boards from low-cost, paper-based (FR-1), to high
speed/high-frequency PTFE are analyzed in depth. Manufacturing processes
and strategic building blocks for conventional prepreg and laminate
production will be introduced. An overview of current markets for these
materials will also be discussed.

Printed Wiring Board - Back to the Basics
March 12, 2008 - IPC Headquarters, Bannockburn, IL

Instructor:  Michael Carano, Electrochemicals, Inc.

 

Please visit this link for additional information:
www.ipc.org/PBCLam0308

The printed circuit board fabrication process is an intricate maze of
interrelated steps, both chemical and mechanical. Each step is critical
to minimize or eliminate costly defects. In this course, we will
identify and explain the basics of printed circuit board fabrication and
the different troubleshooting techniques. 

IPC Webcast Series:  Via Hole Filling Technology and Processes 



Via Hole Filling Technology and Processes: An Overview
March 20, 2008 - 10:00 am - 11:00 am (CT)

 

Via Hole Filling Technology and Processes: The Rest of the Story

March 27, 2008 - 10:00 am - 11:00 am (CT) 

Please visit this link for additional information:
www.ipc.org/ViaHole0308

This IPC webcast series describes the technological drivers behind the
need for via filling in a highly effective and reliable fashion for high
density, high aspect ratio printed wiring boards. Close attention is
paid to the use of these via filling materials for highly complex
circuit designs. 

For additional information on these workshops and webcasts, please
contact Michelle Michelotti at +1 847 597 2822 or at
[log in to unmask]

 


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