Johnson,



If possible, use the solder mask in cross shape at heat sink pad , which

can reduce the void.  If presence of via hole on the heat sink pad, blind

the via hole with solder mask.  Your PCB vendor can do it for you.



(Embedded image moved to file: pic28145.jpg)





Jackson



Tehnical Services Manager

Cookson Electronics - Alpha Metals HK













                                                                           

             johnson zhao                                                  

             <[log in to unmask]                                             

             OM>                                                        To 

             Sent by: TGAsia           [log in to unmask]                      

             <[log in to unmask]>                                           cc 

                                                                           

                                                                   Subject 

             2007/12/24 上午           [TGA] 焊点中有空洞                  

             10:45                                                         

                                                                           

                                                                           

             Please respond to                                             

               johnson zhao                                                

             <[log in to unmask]                                             

                    om>                                                    

                                                                           

                                                                           









各位:

  附件是在软性板上焊接的器件的X-RAY图象,可以明显看到有空洞,我们已经在模板的

开孔上考虑了十字或田字设计,但是还有空洞.各位在工作中有没有遇到过该现象!

Best Regarts!

songtao zhao



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