TGASIA Archives

December 2007

TGAsia@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jackson Chan <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Jackson Chan <[log in to unmask]>
Date:
Wed, 26 Dec 2007 11:08:46 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Hi Andy,



I think your setting temperature is relatively low.  Certainly, it may work

if the heat capacity of pad / component is low + using suitable size of the

soldering tip (size should be just smaller than pad) + good heat transfer /

recovery rate of soldering iron.  In other hand, the activity of the core

flux can help << note: you should also consider the electrical reliability

if choosing high activity of flux >>



You can do the pull/ push test to verify the strength and do cross section

to see the intermetallic layer's thickness / wetting angle to validate the

solder joint



Merry Christmas



Jackson

Technical Services Manager

Cookson Electronics - Alpha Metals HK



-





                                                                           

             "andy.xu"                                                     

             <andy.xu@amphenol                                             

             rfa.com>                                                   To 

                                       "'Jackson Chan'"                    

             2007/12/24 上午           <[log in to unmask]>      

             08:55                                                      cc 

                                       <[log in to unmask]>                    

                                                                   Subject 

             Please respond to         RE: [TGA] 焊鐵頭溫度設定            

             <andy.xu@amphenol                                             

                 rfa.com>                                                  

                                                                           

                                                                           

                                                                           

                                                                           









Hi Jackson,

Thanks a lot of your surport.

我們設置的溫度範圍為︰426~450℃,一般調至435℃,但在焊接時經常會出現過熱焊

點,所以就很困惑。

我們有做試驗,把溫度調至350℃~385℃之間,焊點的潤濕效果還不錯,且不易出現過熱

焊點,焊鐵的壽命也有提高,請問這樣設定的話,會不會有問題?



Best Regards!

Andy Xu(徐  晟)

Clean Room

Amphenol RF  Asia Corp.

Tex :   +86-755-2754  9918  (ext.2304)

Fax :   +86-755-2754  9718

Cell :   +86-1300 6655 655

E-mail : [log in to unmask]



-----Original Message-----

From: Jackson Chan [mailto:[log in to unmask]]

Sent: Saturday, December 22, 2007 7:54 PM

To: [log in to unmask]

Cc: [log in to unmask]

Subject: Re: [TGA] 焊鐵頭溫度設定



Hi Andy,



I think IPC has  no international standard for this type of  " setting "

temperature of your soldering iron machine.  In addition to the alloy and

the activity for core flux of soldering wire, you should also consider the

following factors when establishing your " setting" temperature of your

machine



1.  How fast to produce the solder joint ?



Typically, 2 -3 sec.  For heat-sink conmponent, longer time may be

required.



2. Is it heat sink component or only generall type of component ?



3. Any heat- sensitive component ? If yes, what is the temperature ?



4. Heat transfer capability and temperature recovery capability of your

soldering iron ?



5.  What is the size of pad ?



6. What shape and its size should be chosed ?





You can design the experiment.  Use the thermocouple to measure the change

of the temperature of the soldered area when applying the wire and

soldering tip to see what temperature acheived (+ wetting performance) when

using 2 or 3 sec as the contact time of the soldering iron.



There is the general rule but not true for all  condtions.  I list here for

your reference only.  Typically, the wetting should be acceptable if the

temperature of the solder reach above 50 deg. C over the alloy 's liqudius

point.  If the alloy's liquidius temperature  is 299 deg. C, the soldering

temperature for acceptable wetting to occur is around  350 deg. C.

However, you should also consider the " time" and " heat capability"

factor,  Therefore, for the  temperature setting at your machine, the

general rule is 100 deg. C > the soldering temperature.  In your case, 350

deg. C + 100 deg. C = 450 deg. C.



Take an other example, 63/37 alloy, the melting point is 183 deg. C.  The

soldering temperature should be 183 + 50 =  233 deg. c.  For the settting

temperature, 233 + 100 deg. C = 333 deg. C



Jackson Chan

Technical Services Manager

Cookson electronics - Alpha Metals Hong Kong

















             "andy.xu"

             <andy.xu@AMPHENOL

             RFA.COM>                                                   To

             Sent by: TGAsia           [log in to unmask]

             <[log in to unmask]>                                           cc



                                                                   Subject

             2007/12/22 上午           [TGA] 焊鐵頭溫度設定

             09:00





             Please respond to

             andy.xu@amphenolr

                  fa.com













各位朋友,

在進行手工焊接時,焊鐵頭的溫度該如何設定?

如使用的錫絲為:Kester SN10PB88AG2 #58/245,其溶融溫度為:268~299℃,那麼焊鐵頭

的溫度該設定到多少?

有哪位知道,請不吝賜教!

謝謝!

Best Regards!

Andy Xu(徐  晟)

Clean Room

Amphenol RF  Asia Corp.

Tex :   +86-755-2754  9918  (ext.2304)

Fax :   +86-755-2754  9718

Cell :   +86-1300 6655 655

E-mail : [log in to unmask]

--------------------------------------------------------------------------------------------





NOTE: This electronic message (including any attachments) contains

information which may be privileged, confidential , or copyrighted under

applicable law. The information is intended solely for the use of the

individual(s) or entity named above. If you are not the intended recipient,

please be aware that any disclosure, viewing, copying, alteration,

dissemination, distribution of, or use of the contents of this information

in whole or in part is strictly prohibited. If you received this electronic

transmission in error, please notify the sender immediately by replying to

this message and delete the copy you received.



--------------------------------------------------------------------------------------------

-------------------------------------------------------------------------------------------- 



NOTE: This electronic message (including any attachments) contains information which may be privileged, confidential , or copyrighted under applicable law. The information is intended solely for the use of the individual(s) or entity named above. If you are not the intended recipient, please be aware that any disclosure, viewing, copying, alteration, dissemination, distribution of, or use of the contents of this information in whole or in part is strictly prohibited. If you received this electronic transmission in error, please notify the sender immediately by replying to this message and delete the copy you received. 



-------------------------------------------------------------------------------------------- 


ATOM RSS1 RSS2