各位专家们，
我想请教大家下面的问题：
1、在波峰焊工艺中，常常碰到的问题和对策是：
1）.SOIC 橋接 加 Solder Thieves (偷錫焊盤设计）
SOIC bridging Add solder thieves pad design
2）.QFP 橋接 加Solder Thieves/45角
QFP bridging Add solder thieves pas design
请问以上要求是否在IPC的一些设计标准中有说明？比如IPC -2220系列？
2、需波峰焊的组件，板设计时， 应考虑的元件排列问题：
1）、四方扁平器件，SMD的分布，應減少焊接陰影。 The distribution of QFP & SMD should be free of “shadowing”
(大的器件在小的後面)
(高的器件在低的後面)
The big/high components should be arranged behind the small/short ones.
2）、盡量使用吸熱相同的元器件，使預熱更加一致 (板面預熱，輸送速度)
Use the components with the same thermal mass to ensure the suitable conveyor speed & even pre-heating temperature on the board.
3）、雙列直插器件的兩排引線同傳送方向平行 (IC的兩排引線)
The array of the DIP leads should be parallel with the direction of the travel.
以上几点在有关设计标准中是否也有说明？在那个标准？条款？
3、、为避免焊接时元件容易短路，焊盘间距设计时参考的标准是那个？
谢谢！
Rgds,
Luoisa Qi
Human Resources & Administration
Flextronics Zhuhai Industrial Park
Xin Qing Science & Technology Park
Jing An, Doumen, Zhuhai, P.R.China, 519180
Ext.:7885-62062
Mobile: 13527269496
Fax:: 5555189
Email:[log in to unmask]
-----Original Message-----
From: TGAsia [mailto:[log in to unmask]] On Behalf Of 张俊杰
Sent: 2007年12月18日 14:15
To: [log in to unmask]
Subject: Re: [TGA] (瑞星提示-此邮件可能是垃圾邮 件)Re: [TGA] (鐟炴槦鎻愮ず-姝 ら偖浠跺彲鑳芥槸鍨冨溇閭欢 )[TG A] Join TG Asia
我明白"wrap copper "的意思，对于盲孔板，如何才能这个要求？各位是否有好方法？
Best regards with thanks!
CS engineer Eric zhang（张俊杰）/QA Dept.
Suntak Multilayer PCB Co.,Ltd
mobile phone:13923405590
Tel:+86-755 26068047ext.803
Fax:+86-755 26068048
e-mail:[log in to unmask]
Addr.:No.1040 Nanshan Rd.,Nanshan Dist.Shenzhen,Guangdong,PRC.
----- Original Message -----
From: "Yuet Shan Chan" <[log in to unmask]>
To: <[log in to unmask]>; <[log in to unmask]>
Sent: Tuesday, December 18, 2007 2:06 PM
Subject: (瑞星提示-此邮件可能是垃圾邮件)Re: [TGA] (鐟炴槦鎻愮ず-姝ら偖浠跺彲鑳芥槸鍨冨溇閭欢 )[TGA] Join TG Asia
The amendment page of IPC-6012B 6.2.11.1 can be free download from IPC website. You can see the text and picture description in it. Anyone interested can visit www.ipc.org to search.
Best Regards,
>>> [log in to unmask] 12/18/2007 11:04 AM >>>
IPC-6012B (2007版）3.6.2.11.1 里面有一个"wrap copper "的要求，是2007版的新要求，目前，有中文名。
Best regards with thanks!
CS engineer Eric zhang（俊杰）/QA Dept.
Suntak Multilayer PCB Co.,Ltd
mobile phone:13923405590
Tel:+86-755 26068047ext.803
Fax:+86-755 26068048
e-mail:[log in to unmask]
Addr.:No.1040 Nanshan Rd.,Nanshan Dist.Shenzhen,Guangdong,PRC.
----- Original Message -----
From: [log in to unmask]
To: [log in to unmask] ; [log in to unmask]
Sent: Tuesday, December 18, 2007 10:37 AM
Subject: 回覆: [TGA] (瑞星提示-此邮件可能是垃圾邮件)[TGA] Join TG Asia
铜漆包or漆包管？
Best Regards
Yun, Xunisa ( 黎?yIES030810)
Troubleshooting Room / ICT Team Leader
021-64298888-62340 / Yun.xunisa at inventec.com
英?I?_科技有限公司/?u造二??/生技二部/?a品?S修二?n
------------------------------------------------------------------------------
寄件者: TGAsia [mailto:[log in to unmask]] 代理 俊杰
寄件日期: 2007年12月18日 10:29
收件者: [log in to unmask]
主旨: Re: [TGA] (瑞星提示-此邮件可能是垃圾邮件)[TGA] Join TG Asia
Hi Susan:
do you know what is wrap copper? our company received a complaint form USA just now, we very hope getting some help in the issue.
Best regards with thanks!
CS engineer Eric zhang（俊杰）/QA Dept.
Suntak Multilayer PCB Co.,Ltd
mobile phone:13923405590
Tel:+86-755 26068047ext.803
Fax:+86-755 26068048
e-mail:[log in to unmask]
Addr.:No.1040 Nanshan Rd.,Nanshan Dist.Shenzhen,Guangdong,PRC.
----- Original Message -----
From: Susan Le
To: [log in to unmask]
Sent: Tuesday, December 18, 2007 10:00 AM
Subject: (瑞星提示-此邮件可能是垃圾邮件)[TGA] Join TG Asia
Hello everybody,
I am the laboratories vice director from Microtek (Changzhou) Laboratories. I am very happy to join in the TGAsia.
Best regards,
Susan Le 逸
Microtek (Changzhou) Laboratories
Tel: +86 0519-85487809
Fax: +86 0519-85487810
Email:[log in to unmask]
www.china.thetestlab.com
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