Is there someone out there that has a good reference for setting up blind
via and/or buried via technology for your board designs?
Questions that come to mind are things like:
 
Stackup options:
What is the best stackup arrangement for an 8 layer board with blind vias? 
Best for electrical performance and best for manufacturing of the board?
What options do you have and what are the tradeoffs of using them? 
 
Aspect ratio of the vias: 
What is the best aspect ratio to use? 
When does it get too tough to build? 
What makes it easier to build? 
 
Mistakes to avoid: 
What are the cost drivers?  How can you avoid them? 
What examples of things you have seen attempted that just should not have
been done that way? 
How should they have been done? 
Via geometries, board stackups, etc... 
 
Process options, pro's and con's
 
Etc.., etc.. 
 
Please let me know if you have a source for this sort of data and what your
advice is for someone who is just getting into it.
 
Best regards,
 
Bill
 
 
 
 

---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To temporarily stop/(restart) delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL/(MAIL)
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
---------------------------------------------------------------------------------