Hi Tom,
Maybe the pin location are not that random. With the exception of P16, they
may all be at the outline of the die—I do not know your die size, but I am
guessing. You did not give a thermal history; is it possible that you have
creep-fatigue failures?
214.5 certainly should be sufficient for proper wetting of eutectic SnPb, if
you have solderability.
In order to find out, you need to sacrifice some of your product to
cross-sectioning.
Werner
**************************************
See AOL's top rated recipes
(http://food.aol.com/top-rated-recipes?NCID=aoltop00030000000004)
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------