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Date: | Mon, 3 Dec 2007 08:52:25 -0600 |
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While I do not disagree with Dewey, I think this is less about what kind
of flux is used and more about this being a conformal coat issue. It
sounds like they have a damp environment, but are not conformally coating
the boards. As I tell our designers here, if you have a condensing
environment, you either put the $$$ into the coating or the $$$ into the
housing. You have to provide an environmental barrier somewhere.
Doug Pauls
"Whittaker, Dewey (EHCOE)" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
12/03/2007 08:46 AM
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Re: [TN] Wave solder flux volume measurements
Your Environmental condition was damp/moist. Is that opposed to damp/dry
or dry/moist? It would more helpful to relate it to temperature and
relative humidity with the additional qualifier of standing water or
not.
A general rule of thumb (besides move it before striking with heavy
objects) is that no-cleans should not be used in that application. A
cleanable no-clean or better yet a water soluble flux should be used.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joel Alexander
Sent: Friday, November 30, 2007 2:25 PM
To: [log in to unmask]
Subject: [TN] Wave solder flux volume measurements
Hi guys its me again,
We have a customer that builds power systems for the Telcom companies.
They recently had a field failure on a backplane. It had sever
corrosion.
We process the assembly with a VOC no-clean solder and have never had
issues in the past. The customer indicated that the backplane was in a
damp/moist environment. That is not a good combination for no clean
flux.
I suggested cleaning but they insisted that we monitor our flux volume
to
ensure it is at the recommended application volume. I did not really
agree
from a reliability standard.
Does anyone out there measure their no clean flux volume on a regular
basis?
Joel Alexander
Quality Assurance Manager
TT APSCO, INC.
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