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Date: | Wed, 12 Dec 2007 13:59:15 +0100 |
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a few questions:
-exactly WHAT get tarnished, dielectric, copper, solder?
-WHAT will be "grounded"?
-you can't decide RF ground with a multimeter.
-WHAT microwave product do you work with? Sometimes, a board in a
microwave set is not a RF board at all, but driver or logics etc.
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kong Hui Poh
Sent: den 12 december 2007 13:43
To: [log in to unmask]
Subject: Re: [TN] Tarnished on the bottom side (Teflon Board)
Hi Technetterers,
I am facing with board that after reflow, it turned tarnished.
The board is of tin-lead plating.
The top side of the board consists of the circuitry & components.
The bottom side of the board is a complete plane.
My customers said that there will be grounding due to the tarnished.
However, I try using Multimeter, and probe the bottom side very lightly.
The measurement I got is less than 0.5 Ohm.
Somehow, the measurement shows otherwise.
I wandered if there is an issue with the grounding if the board is
tarnished.
Can someone advise me if any of the IPC spec states that board of
tin/lead plating, if found tarnished is a reject/defect.
Is any of the IPC spec. defines the solder surface requirement for the
Microwave end product (if after reflow).
Thanks you in advance.
Regards,
Poh
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