There is a correct amount of flux for every joint. Too much can be worse 
than too little. Bigger is not better.

Brian

Ted Tontis wrote:
> Currently we have assemblers who are hand fluxing some TH components at the
> slide line prior to the wave. Some believe that when it comes to hand
> fluxing more is better and flood a whole section of a PCB with flux. My
> concern is that some of the assemblies that have been flooded with flux, on
> the primary side, will have active material left behind after the wave
> process.  I know that this is a training issue and I would say that 90% do
> not need to have flux added and with out the flux we get a perfect class 2
> solder joint. I am working on changing the mind set that top flow is
> necessary to be an acceptable class 2 joint. 
> 
> I have an assembly array that I would like to flood one side with flux and
> leave the other side alone, send it through the wave process and then throw
> it into an environmental chamber. My question is can anyone give me an idea
> on what the best settings would be to get the results I am looking for? I am
> trying to prove or disprove that there is some active agents left on the
> assembly and the pre-heaters are not enough to remove them all. I can not
> use SIR testing because I am looking for specific locations of active
> agents, not an overall level of contamination across the array. Ion
> chromatographs are out of the question due to the cost of testing. I would
> also like to use this as a visual aid when it comes to the retraining of
> assemblers, if it really is an issue. 
> 
>  
> 
> Thank you,
> 
>  
> 
>  
> 
> Ted Tontis
> 
> Quality Engineer
> 
> Borg Indak, Inc.
> 
> 701 Enterprise Dr 
> Delavan, WI 53115
> 
> P 262-245-3060
> 
> F 262-728-3788
> 
> [log in to unmask]
> 
> www.borgindak.com <http://www.borgindak.com/> 
> 
>  
> 
> 
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