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November 2007

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Subject:
From:
Ted Tontis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ted Tontis <[log in to unmask]>
Date:
Thu, 1 Nov 2007 09:16:57 -0500
Content-Type:
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Currently we have assemblers who are hand fluxing some TH components at the
slide line prior to the wave. Some believe that when it comes to hand
fluxing more is better and flood a whole section of a PCB with flux. My
concern is that some of the assemblies that have been flooded with flux, on
the primary side, will have active material left behind after the wave
process.  I know that this is a training issue and I would say that 90% do
not need to have flux added and with out the flux we get a perfect class 2
solder joint. I am working on changing the mind set that top flow is
necessary to be an acceptable class 2 joint. 

I have an assembly array that I would like to flood one side with flux and
leave the other side alone, send it through the wave process and then throw
it into an environmental chamber. My question is can anyone give me an idea
on what the best settings would be to get the results I am looking for? I am
trying to prove or disprove that there is some active agents left on the
assembly and the pre-heaters are not enough to remove them all. I can not
use SIR testing because I am looking for specific locations of active
agents, not an overall level of contamination across the array. Ion
chromatographs are out of the question due to the cost of testing. I would
also like to use this as a visual aid when it comes to the retraining of
assemblers, if it really is an issue. 

 

Thank you,

 

 

Ted Tontis

Quality Engineer

Borg Indak, Inc.

701 Enterprise Dr 
Delavan, WI 53115

P 262-245-3060

F 262-728-3788

[log in to unmask]

www.borgindak.com <http://www.borgindak.com/> 

 


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