Werner/Dewey/Hanna,
Thank you for the information...it will help with the issues I face,
well at least the ones regarding specifying lamination materials.
eric
________________________________
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, November 08, 2007 3:19 PM
To: Honsowetz, Eric; [log in to unmask]
Subject: Re: [TN] Specifications for the Epoxy in Glass/Epoxy Boards
Hi Eric,
Things are a little more complex than that, I am afraid.
I would suggest you obtain my White Paper "Recommendations for PCB FAB
Notes and Specifications in Printed Circuit Board Drawings for SnPb and
Lead-Free Soldering Assemblies, the Qualification of PCB Shops and
Activities to Assure Continued Quality." It is to my knowledge the only
pretty comprehensive [cannot be totally comprehensive becaus ethis is a
very fast mocing situation] source dealing with all the issues of PCB
specifications.
Please go to my website for details.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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