IPC is sponsoring a one-day IPC International Conference on Flexible
Circuits to be held on February 13, 2008 in Phoenix, Arizona. This
conference will be held in conjunction with the Interim meetings. 

 

IPC is seeking speakers to present on the following topics but not
limited to:

 

New product application

Global market trends

Design strategies for flex

Material alternatives

Processing innovations

Fine line flex - increasing interconnect density

Flex assembly

Flex and lead-free

Flex in printed electronics

Fine pitch and high density packaging for flex

Reliability and testing data

 

Please send a brief abstract to Alexandra Curtis at
[log in to unmask] by December 7, 2007. 

 


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