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November 2007

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Crawford <[log in to unmask]>
Date:
Tue, 6 Nov 2007 22:38:25 -0600
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This message was initially sent to members of the IPC Assembly and
Joining and related committees.

After reviewing the information below, if you have an interest in being
part of the developing and balloting committee for this document, you
must reply to the IPC staff liaison [log in to unmask] advising of
your interest and you will be added to the IPC B-10a task group.

J-STD-075 Classification of Non-IC Electronic Components for Assembly
Processes is an outgrowth of IPC/JEDEC J-STD-020 "Moisture/Reflow
Sensitivity Classification for Non-hermetic Solid State Surface Mount
Devices" and IPC-9503 Moisture Sensitivity Classification for Non-IC
Components. These two documents focus on issues related to moisture
absorption in non-hermetic electronic components. There is a shortfall
in standards and test methods that can be used to test and classify
components that may be damaged from thermal damage during the assembly
process.

J-STD-075 is a fast-track document that being developed through
collaboration of Electronic Components Association, IPC, and JEDEC.
Efforts to this point has primarily been at the working group level as
agenda items in conjunction with other ECA or JEDEC events with minimal
input from component users. The classification levels that will be
established by this standard will have significant impact to assemblers
and your review and comments are encouraged.

A copy of J-STD-075 is available for your review. The file is in PDF
format and can be opened with the freeware Adobe Acrobat Reader
(www.adobe.com). Included with the file is a ballot comment form.

The document, comment list and comment form can be downloaded from:
http://files.ipc.org/J-STD-075-ballot.zip

We are now using an online survey tool to enable you to more easily
submit your vote. After you have reviewed the document, please access
the following link to submit your ballot:
http://www.surveymonkey.com/s.aspx?sm=Oz9EnYV708ql4cGmoqzmJQ_3d_3d

PLEASE NOTE THAT ONLY ONE VOTE CAN BE COUNTED PER COMPANY SITE.

If you have comments, please return the comment form to
[log in to unmask] with "J075 comments" in the subject line. All
technical comments must be responded to in writing from the task group
leaders and the IPC staff. These records become a permanent part of the
document file. If the comments are editorial in nature, they can be
incorporated and need no official response. Editorial comments are not
grounds for rejection.

Please return all comments to Jack Crawford at IPC Headquarters as soon
as possible, or by December 14, 2007 at the latest.

We would like to give special thanks to Steve Martell, Sonoscan, for
leading the IPC effort on this important project.

Jack Crawford, IOM
IPC Director Certification and Assembly Technology [log in to unmask]
847-597-2893
FAX  847-615-5693
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015

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