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November 2007

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Subject:
Rohs process on non-rohs assembly
From:
Peter L <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Peter L <[log in to unmask]>
Date:
Sun, 4 Nov 2007 23:45:59 -0600
Content-Type:
text/plain
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text/plain (24 lines) 
Dear technet,

I am looking at quantifying the risk associated with a SnPb PCBA mistakenly 
processed under RoHS reflow condition and would like to collect some input on 
what I would expect to see on the result. This may include having the board 
destructive tested.

In general, what would be the impact on a non-rohs PCBA (normal FR4, SnPb 
solder paste used in assembly) if a rohs process (i.e. elevated reflow temp) 
was applied? Aside from impact to components, how would the elevated 
temperature pose risk to solder joint integrity and PCB reliability? 

Any input is appreciated. 

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