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November 2007

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Subject:
From:
Kong Hui Poh <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 30 Nov 2007 13:25:15 +0800
Content-Type:
text/plain
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text/plain (36 lines)
Hi Technetters,

I am facing a problem with a tin/lead plating board.

I am facing a problem with boards that are of Roger material and was  
tin/lead plated.

The traces are not being masked, hence exposed.

We subject the boards to reflow, and those area where no solder joint  
turned tarnish.

This is the first time we handle such kind of board. We have no  
experience on this.

I wander if tarnish is a defect. Can someone advise me how to remove  
this tarnish  as I try using IPA to rub it off, it seems nothing  
happened.
I could not find this in the IPC.

Please advise me.

Thanks.

KH Poh

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