At the interface between the solder in the fillet and the PdAg
metallisation, in time there is a mass transport of silver from the
metallisation to the solder, faster than the growth of the
intermetallic, leaving Kirkendahl voids. At the end the capacity of
the component will slowly decrease because the connection between
metallisation and the film conductors in the body got lost.


Peer Langeveld
Consultant Soft Soldering Processes
5502 VH 8  The Netherlands



2007/11/29, Kevin Glidden <[log in to unmask]>:
> Hi everyone,
>
>
>
> An EE asked me about an SMT component he wants to use, but it is available
> in only palladium-silver finish.  He was asking if that finish is acceptable
> to use in our process (Sn63Pb37 alloy).  I have never used this finish
> before.  Any caveats?  In case it matters, the component is an 1825 ceramic
> cap.
>
>
>
> Thanks in advance.
>
>
>
> Kevin Glidden
>
> Manufacturing Engineer
>
> Luminescent Systems Inc.
>
>
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