I missed that point. Are all the heaters working properly?
Is your air flow at the min you require to stop fumes escaping from I/O, could it be turned up too high?
I wouldn't take too much notice of Electroverts recommended airflow!
Rex
Rex Waygood
Technical Manager
PartnerTech Poole Ltd
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: 29 November 2007 15:19
To: [log in to unmask]
Subject: Re: [TN] SN100C process
Mike,
Thanks for the insight. What worries me is that 540F is actually 280C. I didn't go there yet, but I am at 274C (525F) and still see the solder freezing at the corners of the pot. Although this must be a machine issue, did not get much help from the manufacturer.
I've got your point regarding VOC free fluxes.
Thanks,
Ioan
-----Message d'origine-----
De : Mike Fenner [mailto:[log in to unmask]] Envoyé : 29 novembre 2007 09:47 À : 'TechNet E-Mail Forum'; Ioan Tempea Objet : RE: [TN] SN100C process
While we wait for Ronnie......
540F is about 250something C, that's about in the 'normal' range. Don't forget the SN100C is a tin/copper not a SAC and so has a higher MP/operating range.
For LF wave soldering you probably need to have a little higher solids than for leaded, and some VOC formulations are definitely more suited to lead free than IPA based materials. This is all down to the properties of high SN content of lead free alloys and their associated temperatures as a whole rather than specific differences between them.
You should be able to solder satisfactorily without nitrogen as a soldering aid, but do have nitrogen as a dross limiter.
Specific process parameters will depend on your specific alloy ,machine, flux and board type. You will probably be better to have those conversations individually off line or get ideas from other user experiences.
Overall there is no intrinsic reason why you should not be able to wave solder lead free with very low defect levels, board/design/components are still the ultimate limiting factors in this process.
Regards
Mike Fenner
Indium Corporation
T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
E: [log in to unmask]
W: www.indium.com
Pb-free: www.Pb-Free.com
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Registered office: (Not for correspondence)
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Wednesday, November 28, 2007 3:55 PM
To: [log in to unmask]
Subject: [TN] SN100C process
Dear Technos,
I have moved to this new company and here we're running SN100C in wave, as
opposed to the SAC305 I used to have before. So I have to start all over
defining the baseline process parameters.
Besides frequent shorts and solder not going all the way to the top, we have
an issue with solder freezing at the corners of the solder pot. To overcome
this "chilly" issue, we were suggested to run the pot at 540F!
So I would like to know where you are with the SN100C:
* What pot temperature
* What conveyor speed range
* What flux (special formulation for the alloy or regular,
solids content, water or alcohol based, etc)
* Nitrogen or not
* Other particular points of interest
Of course an insight regarding the attainable defect free yields would also
be appreciated.
Thank you,
Ioan
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