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November 2007

TechNet@IPC.ORG

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
Date:
Thu, 29 Nov 2007 09:01:19 -0500
Content-Type:
text/plain
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Without a nickel barrier the finish can dissolve completely into the solder
leaving the component bare. The defect condition is identified in the IPC
standards as leaching. This finish is common in applications when the
magnetic properties of nickel are unacceptable. A small amount of silver in
the paste, seems to widen the processing window.  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kevin Glidden
Sent: Thursday, November 29, 2007 8:15 AM
To: [log in to unmask]
Subject: [TN] Palladium Silver Surface Finish

Hi everyone, 

 

An EE asked me about an SMT component he wants to use, but it is available
in only palladium-silver finish.  He was asking if that finish is acceptable
to use in our process (Sn63Pb37 alloy).  I have never used this finish
before.  Any caveats?  In case it matters, the component is an 1825 ceramic
cap.

 

Thanks in advance.

 

Kevin Glidden

Manufacturing Engineer

Luminescent Systems Inc.


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