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November 2007

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Subject:
From:
Rex Waygood <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rex Waygood <[log in to unmask]>
Date:
Wed, 28 Nov 2007 16:17:53 -0000
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Rex Waygood
Technical Manager
 
PartnerTech Poole Ltd 
Benson Road
Poole
Dorset BH17 0RY
United Kingdom
 
Tel: +44 (0)1202 674333
Fax: +44 (0)1202 678028
DDI: +44 (0)1202 338222
Mob: +44 (0)7887 997403
 
[log in to unmask]
www.PartnerTech.co.uk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: 28 November 2007 15:55
To: [log in to unmask]
Subject: [TN] SN100C process

Dear Technos,

 

I have moved to this new company and here we're running SN100C in wave,
as opposed to the SAC305 I used to have before. So I have to start all
over defining the baseline process parameters.

 

Besides frequent shorts and solder not going all the way to the top, we
have an issue with solder freezing at the corners of the solder pot. To
overcome this "chilly" issue, we were suggested to run the pot at 540F!

 

So I would like to know where you are with the SN100C:

*          What pot temperature
265C

*          What conveyor speed range
~1.2 metres/minute

*          What flux (special formulation for the alloy or regular,
solids content, water or alcohol based, etc)
Kester 979

*          Nitrogen or not
Not

*          Other particular points of interest
Vectra/2 forced convection preheats/ all carrier based/ Chip wave/ Air
knife

 

Of course an insight regarding the attainable defect free yields would
also be appreciated.
Getting better, not quite down to SnPb levels yet

 

Thank you,

 

Ioan


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