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November 2007

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Subject:
From:
Ioan Tempea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ioan Tempea <[log in to unmask]>
Date:
Wed, 28 Nov 2007 10:55:21 -0500
Content-Type:
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text/plain (53 lines)
Dear Technos,

 

I have moved to this new company and here we're running SN100C in wave,
as opposed to the SAC305 I used to have before. So I have to start all
over defining the baseline process parameters.

 

Besides frequent shorts and solder not going all the way to the top, we
have an issue with solder freezing at the corners of the solder pot. To
overcome this "chilly" issue, we were suggested to run the pot at 540F!

 

So I would like to know where you are with the SN100C:

*          What pot temperature

*          What conveyor speed range

*          What flux (special formulation for the alloy or regular,
solids content, water or alcohol based, etc)

*          Nitrogen or not

*          Other particular points of interest

 

Of course an insight regarding the attainable defect free yields would
also be appreciated.

 

Thank you,

 

Ioan


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