Agreed - but the customer had already made that decision!
Peter
--------------------------------------------------------
Peter Swanson [log in to unmask]
INTERTRONICS http://www.intertronics.co.uk
Tel: +44 1865 842842 Oxfordshire, England
INTERTRONICS is dedicated to providing quality material, consumable
and equipment solutions to the high technology, high performance
assembly industries, incorporating outstanding levels of technical
support and customer service.
Read our news! http://www.intertronics.co.uk/blog/blog.htm
-----Original Message-----
From: Yuan-chia Joyce Koo [mailto:[log in to unmask]]
Sent: 22 November 2007 01:04
To: TechNet E-Mail Forum; Peter Swanson
Subject: Re: [TN] Epoxy application
guys, may be I am out of lunch... change material consider at major
change. Unless you know the assembly design spec and operation
condition (operational temp range,vib level, etc.), you could not just
swap RTV for some rigid material. good luck...jk On Nov 21, 2007, at
10:58 AM, Peter Swanson wrote:
> Peter,
>
> You don't say how many of these you are making, but with that proviso:
>
> 1) A single part "chipbonder" or surface mount adhesive like the one
> mentioned will require a substantial heat bump to cure.
>
> 2) Rather than an epoxy, maybe a methacrylate adhesive would be better
> - often less brittle, but good all round adhesion. Something like
> Araldite
> 2022 is a two part product, but in a cartridge, so easy to apply.
> Might
> still me a bit smelly through....
>
> 3) If you have, or can justify the purchase of the equipment, then a
> UV acrylic adhesive does this job well. No mix, fast cure, good
> adhesion, choose your viscosity and the right resiliency to give the
> stress relief.
>
> Regards,
> Peter
>
> --------------------------------------------------------
> Peter Swanson [log in to unmask]
> INTERTRONICS http://www.intertronics.co.uk
> Tel: +44 1865 842842 Oxfordshire, England
>
> INTERTRONICS is dedicated to providing quality material, consumable
> and equipment solutions to the high technology, high performance
> assembly industries, incorporating outstanding levels of technical
> support and customer service.
>
> Read our news! http://www.intertronics.co.uk/blog/blog.htm
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
> Sent: 21 November 2007 13:28
> To: [log in to unmask]
> Subject: Re: [TN] Epoxy application
>
> Hello, Peter
> I have a client using Loctite 3621 epoxy in a very similar
> application.
> It bonds to the mylar sleeving very well. Try it.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter L
> Sent: Tuesday, November 20, 2007 6:00 PM
> To: [log in to unmask]
> Subject: [TN] Epoxy application
>
> Hello,
>
> I would like to ask for opinion on an epoxy application. We apply RTV
> to bond and secure 2 electronic devices on a PCB.
>
> But after noticing the RTV bond breaking off during vibration test,
> our customer has specs in a 5min 2-part epoxy (made by
> http://www.devcon.com/techinfo/5_MINUTE_FR.pdf) to replace the RTV.
> The
> problem is that the Devcon epoxy is fast cure, requries 2 part mixing,
> and carries a strong, irritating odor. I would like to move away from
> using Devcon and expect that there must be more process friendly epoxy
> for such application.
>
> The 2 materials to be joined were a flat ferrite inductor and round
> capacitor having a PVC sleeve. Due to positioning of the 2 devices
> there is generally a ~0.25" gap between them for the epoxy to fill.
> The epoxy bead deposit is about .75" long x 0.5" wide. (see following
> link to the assembly
> http://members.shaw.ca/ppwlee4/Epoxy_appl.JPG)
>
> I am looking for recommendation of a suitable epoxy to allow:
>
> - 5-10 min working life before it starts curing
> - process friendly (smell, preferrable no pre-mix)
> - good adhesion to the component/PCB surfaces.
>
> Any suggestion is appreciated. Thanks.
>
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
> unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> or
> (re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> archives of previous posts at: http://listserv.ipc.org/archives Please
> visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for
> additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
> unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> or
> (re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> archives of previous posts at: http://listserv.ipc.org/archives Please
> visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for
> additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 15.0 To
> unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/
> archives Please visit IPC web site http://www.ipc.org/contentpage.asp?
> Pageid=4.3.16 for additional information, or contact Keach Sasamori at
> [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
