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November 2007

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From:
Tina Nerad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tina Nerad <[log in to unmask]>
Date:
Wed, 21 Nov 2007 14:42:06 -0600
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Registration is now open for IPC's upcoming workshops in January,
February and March of 2008! This is your opportunity to gain in-sight on
the latest information regarding current issues on the latest in
electronics!  

 

Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect
Analysis and Prevention 
January 15, 2008 - San Jose, CA
8:30 am - 11:30 am

Instructor:  Michael Carano, Electrochemicals, Inc.

 

What are the critical success factors for a defect-free PWB fabrication
process and maximum long-term reliability? This course tackles the
answers! Join us for this half-day workshop and gain the
process-technology know-how you need to improve the yield, quality and
reliability of complex printed wiring boards. Emphasis is on identifying
and preventing defects with respect to electroless copper and direct
metallization, electroplating, drilling and multilayer fabrication.

 

Via Filling Technology and Processes
January 15, 2008 - San Jose, CA
1:00 pm - 4:00 pm

Instructor:  Michael Carano, Electrochemicals, Inc.

Attend this course for in-sights on the technological drivers behind the
need for highly effective, reliable via filling in high-density,
high-aspect-ratio printed wiring boards. The course pays close attention
to the use of via filling materials for highly complex circuit designs.

Fundamentals of Printed Circuit Technology - Materials and Manufacturing
Processes 
January 16, 2008 - San Jose, CA
8:30 am - 11:30 am

Instructor:  Joseph Fjelstad, Silicon Pipe, Inc.

This half-day course provides a comprehensive overview of this
indispensable technology. It reviews the materials and processes that
comprise the wide array of electronic interconnection substrates used
today and why they were chosen. You will learn about multilayer, metal
core, embossed, flexible and rigid flex circuits and more. Discussions
will also include newer HDI/microvia and embedded passives technologies,
new PCB design concepts and a brief look at the impact of lead free on
PCB manufacturing. 

Design Principles for BGA and CSP Technology Implementation
January 16, 2008 - San Jose, CA 
1:00 pm - 4:00 pm

Instructor:  Vern Solberg, Tessera Technologies, Inc.

This workshop is based on the latest version of the IPC-7095 document,
Design and Assembly Process Implementation for BGAs, and covers both
wide and fine-pitch BGA packaging methodology. The information will
focus on IC packaging standards, review qualification requirements and
study land pattern geometry alternatives, circuit routing guidelines as
well as important factors related to high density PCB fabrication
technologies, assembly process development, inspection criteria and
solder quality assessment.

Register for these courses by December 21 and receive a 10% discount or
register three individuals from your company at the same time and
receive the fourth registration FREE. For more information or to
register, please cut and paste www.ipc.org/AdvTr0108 into your browser
and download the registration form.

Fundamentals of Printed Circuits - Materials, Structures and Processes
February 12, 2008 - Phoenix, AZ 
8:30 am - 5:00 pm

Instructor:  Joseph Fjelstad, Verdant Electronics

PCBs are the electrical interconnection platform for nearly every
electronic product. This tutorial provides a detailed overview of this
indispensable technology. It reviews the materials and processes that
comprise the wide array of electronic interconnection substrates used
today - and explains why they were chosen. 

Desmear Metallization and Plating of Flex & Rigid Flex Printed Wiring
Boards
February 14, 2008 - Phoenix, AZ
8:30 am - 11:30 am

Instructor:  Michael Carano, Electrochemicals, Inc.

Understanding the intricate nature of materials and processes is
critical to ensuring highly reliable performance of printed wiring
boards. In this workshop, you will gain insights and get recommendations
on the desmear and metallization of flexible, rigid-flex and
high-performance rigid materials. Direct metallization will be compared
and contrasted to conventional electroless copper systems. Be sure to
join us for this enlightening workshop! 

Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect
Analysis and Prevention
February 14, 2008 - Phoenix, AZ
1:00 pm - 4:00 pm

Instructor:  Michael Carano, Electrochemicals, Inc.

What are the critical success factors for a defect-free printed wiring
board fabrication process and maximum long-term reliability? This course
tackles the answers! Join us for this half-day workshop and gain the
process-technology know-how you need to improve the yield, quality and
reliability of complex printed wiring boards. 

Register for these courses by January 14, 2008 and save an additional
10% off the current registration prices or register three individuals
from your company at the same time and receive the fourth registration
FREE.

For more information or to register, please cut and paste
www.ipc.org/Interim0208 into your browser and download the registration
form.

 

Design for Manufacture, Assembly and Test 
Hosted by Hunter Technology- Santa Clara, CA 
February 26-27, 2008

8:30 am - 5:00 pm

Instructor:  Dieter Bergman, IPC

Designing printed board assembly is more difficult today than ever
before. Printed board designers are faced with the continuing design
issues of surface mount vs. through-hole technology, what materials to
use, board size and layer count, how to incorporate electrical testing,
impedance control requirements, and what new specifications are being
invoked on the design process and many other topics. The tolerance
characteristics that make sense using the capabilities of today's
manufacturing equipment will also be discussed. Attendees will have a
unique opportunity to obtain first hand information on design issues
that affect PCB assembly.

Register for this course by January 28, 2008, and save an additional 10%
off the current registration prices or register three individuals from
your company at the same time and receive the fourth registration FREE.
For more information, please cut and paste www.ipc.org/DFAHunter into
your browser and download the registration form.

 

PCB Laminate Materials and the RoHS Change: IPC-4101 Specification,
Bromine Free and Reliability 
March 11, 2008 - Bannockburn, IL

Instructor:  Doug Sober, Kaneka Texas Corporation

This workshop focuses on laminate and prepreg materials with a special
focus on the grades, properties, testing and composition necessary
lead-free assembly. All grades of base materials used in printed boards
from low-cost, paper-based (FR-1), to high speed/high-frequency PTFE are
analyzed in depth. Manufacturing processes and strategic building blocks
for conventional prepreg and laminate production will be introduced. An
overview of current markets for these materials will also be discussed.

Printed Wiring Board - Back to the Basics
March 12, 2008 - Bannockburn, IL

Instructor:  Michael Carano, Electrochemicals, Inc.

The printed circuit board fabrication process is an intricate maze of
interrelated steps, both chemical and mechanical. Each step is critical
to minimize or eliminate costly defects. In this course, we will
identify and explain the basics of printed circuit board fabrication and
the different troubleshooting techniques. 

Register for this course by February 11, 2008, and save an additional
10% off the current registration prices or register three individuals
from your company at the same time and receive the fourth registration
FREE. For more information, please cut and paste www.ipc.org/PBCLam0308
into your browser and download the registration form.

 

 

 

 

 


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