One webcast in the series remains! 

Via Hole Filling Technology and Processes Webcast Series

Speaker:  Michael Carano, Electrochemicals, Inc.

 

The Rest of the Story

November 8, 2007 

10:00 a.m. - 11:00 a.m. (CT)

 

The following topics will be addressed at this informative webcast!

*	Introduction to via filling with polymer based materials 
*	Why use polymer based materials 
*	Conductive versus non-conductive via fills 
*	Material considerations 
*	Electrical/physical properties 
*	Methods of via filling 
*	Hand screening 
*	Roller coating 
*	Vacuum plugging equipment 
*	Over metallization considerations 
*	Troubleshooting 

For more information, or to register, please visit
www.ipc.org/ViaHoleWC.  For additional questions, contact Michelle
Michelotti at 847.597.2822 or e-mail at [log in to unmask]


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