Hello,
 
I would like to ask for opinion on an epoxy application. We apply RTV to bond 
and secure 2 electronic devices on a PCB. 

But after noticing the RTV bond breaking off during vibration test, our 
customer has specs in a 5min 2-part epoxy (made by 
http://www.devcon.com/techinfo/5_MINUTE_FR.pdf) to replace the RTV. The 
problem is that the Devcon epoxy is fast cure, requries 2 part mixing, and 
carries a strong, irritating odor. I would like to move away from using Devcon 
and expect that there must be more process friendly epoxy for such 
application.

The 2 materials to be joined were a flat ferrite inductor and round capacitor 
having a PVC sleeve. Due to positioning of the 2 devices there is generally a 
~0.25" gap between them for the epoxy to fill. The epoxy bead deposit is 
about .75" long x 0.5" wide. (see following link to the assembly  
http://members.shaw.ca/ppwlee4/Epoxy_appl.JPG)

I am looking for recommendation of a suitable epoxy to allow:
 
- 5-10 min working life before it starts curing
- process friendly (smell, preferrable no pre-mix)
- good adhesion to the component/PCB surfaces.

Any suggestion is appreciated. Thanks.


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