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November 2007

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Tue, 20 Nov 2007 22:25:40 +0200
Content-Type:
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text/plain (101 lines)
Hi,

Keep in mind that in vacuum, there is no forced air convection, only
heating by radiation and conduction so you gain from low boiling point a
evaporation but you loose the air convection.
You should verify that each tray should touch the metal shelf for the
temp. conduction.

 
Best Regards
Reuven ROKAH 
e mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Tuesday, November 20, 2007 9:52 PM
To: [log in to unmask]
Subject: Re: [TN] Vacuum Baking of MSDs

Not sure why it would be thought to reduce the time anyway?

Reducing the pressure will lower the boiling point and hence the
temperature
needed to remove the moisture from the package - but I do not see any
reason
why there should be t\a time reduction expectation.

Now if the temperature was left at 100C+ and the vacuum applied then
that
would definitely lead to a shorter time expectation but might also lead
to
package damage.........8-)

 
 
John Burke
 
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gumpert, Ben
Sent: Tuesday, November 20, 2007 10:27 AM
To: [log in to unmask]
Subject: [TN] Vacuum Baking of MSDs

Anyone want to make a comment (to support or refute) on the following
statement regarding moisture sensitive parts?

"Contrary to some claims, vacuum was not found to accelerate the rate
that moisture is withdrawn from a plastic package."

>From the following article:
http://circuitsassembly.com/cms/content/view/5610/95/

Ben

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