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November 2007

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Tue, 20 Nov 2007 11:37:41 -0500
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Sherif

The real issue with laser drilled holes is plating the via which is usually 
blind. Aspect ratios above 0.8 become a challenge which is even more 
impacted by the diameter of the hole. The hole you suggested has a aspect 
ratio of 1.0, the quality of the plating will be problematic.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389



----- Original Message ----- 
From: "Sherif Refaat" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, November 19, 2007 10:18 AM
Subject: [TN] Laser drilling limitations


> Hi Technetters;
>
> What is a practical maximum via hole diameter and depth manufactured using
> Laser ablation? I would say these should be 0.006" and 0.006". Any 
> different
> opinions?
>
> Sherif,
>
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