Hi;

What are the steps to manufacture plugged vias in pads. The following comes 
to mind

- Electroless copper.
- Apply photo resist that exposes only the vias.
- Electro plating vias only.
- Strip resist.
- Plug vias with epoxy.
- Planarization.
- Electroless copper again (to cover the epoxy that is plugging the vias).
- Continue as usual.

Is there a better way? Would using panel plating be a better alternative 
(The board has 0.005" lines. 1/4 oz copper foil may be helpful)?

Thanks in advance.

Sherif

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