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November 2007

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Sat, 17 Nov 2007 10:24:40 -0500
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Hi Victor,

We see a lot of "hole wall pull away" (HWPA) in RoHS applications, and I agree with Werner's statement, but would like to add one more consideration; out gassing. Recently some "high end" materials have been producing catastrophic HWPA to the degree that internal interconnect are broken. Normal HWPA is considered relatively benign, from a reliability point of view, even stress relieving, but if it causes post separation, well that is not benign.

Sincerely,

Paul Reid

Program Coordinator

PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1

613 596 4244 ext. 229
[log in to unmask] <mailto:[log in to unmask]> 
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor G. Hernandez
Sent: Wednesday, November 07, 2007 10:04 AM
To: [log in to unmask]
Subject: [TN] Post Thermal Stress Hole Wall Pull Away Criteria, cross
section analysis


Fellow TechNetters:

   Where can I find acceptability for PTH quality?

Victor,

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