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November 2007

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phil Nutting <[log in to unmask]>
Date:
Thu, 15 Nov 2007 12:50:01 -0500
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Good afternoon,

A problem has cropped up with a board built by a CM.  The board was
soldered using a no-clean flux (I don't know which one yet) and
apparently it got on the fine pitch pins of a micro D-Sub rendering the
board non-functional because of the insulative layer of flux on some or
all pins.

So if you are sending a board to a CM;
    do you specify the method of cleaning the board?
    do you specify parts that must be clean after the build?
    if no-clean is used, but you require a clean board to a specific IPC
level, isn't it better to use an OA or RMA washable flux?

Replacing these connectors my be more costly than simply trashing the
boards due to the time to remove and replace the connectors not to
mention the possible reliability issues.  I believe the only feasible
method of removing this connector is with a selective soldering system
so all 64 pins can be unsoldered at the same time.  Don't have one of
these systems.

Assuming I can find out what flux was used is there a way to clean these
connectors successfully?  Sounds like a call to Zestron.

Thanks in advance.

Phil Nutting
    

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