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November 2007

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Subject:
IC Pkg Substrate Mfg Questions
From:
Richard Snogren <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Snogren <[log in to unmask]>
Date:
Thu, 15 Nov 2007 06:34:43 -0700
Content-Type:
text/plain
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text/plain (50 lines) 
I am looking for information related to manufacturing of substrates using
the build up process.  Like a 2/2/2 or 3/4/3 build up structure.

 

What are the common or most popular panel sizes used

 

What panelization rules apply? i.e.,

Use of sub panels

Spacing

Test coupons 

Borders etc.

 

 

 

Sincerely,

 

Richard Snogren

Bristlecone LLC

303-972-4721 Land

303-898-9340 Cell

 


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